The 70th JSAP Spring Meeting 2023

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Symposium (Oral)

Symposium » 【Open Symposium】Connection : From BEOL to Tiplet, and to the Future **In corporation with The Japan Institute of Electronics Packaging (JIEP)

[16a-E302-1~6] 【Open Symposium】Connection : From BEOL to Tiplet, and to the Future **In corporation with The Japan Institute of Electronics
Packaging (JIEP)

Thu. Mar 16, 2023 9:00 AM - 12:10 PM E302 (Building No. 12)

Noriaki Matsunaga(Applied Materials Japan), Yasumitsu Orii(Rapidus), Fumihiro Inoue(YNU)

9:30 AM - 10:00 AM

[16a-E302-2] Microelectronics Packaging Engineering and Advanced System Integration Technology

〇Takafumi Fukushima1 (1.Tohoku Univ.)

Keywords:Microelectronic Packaging, 3D Packaging and Integration, Interposer

From the era of integrating transistors into a single chip, we are now in a generation where system performance is dominated by the number of transistors integrated in an advanced semiconductor packages such as interposers and RDLs (redistributed wiring layers). The representative technologies are FOWLP, Si interposer, organic (RDL) interposer, Si bridge, and other 2.xD architectures, which are becoming more and more diverse. This paper discusses the latest trends in these technologies and the importance of microelectronic packaging engineering.