The 70th JSAP Spring Meeting 2023

Presentation information

Symposium (Oral)

Symposium » 【Open Symposium】Connection : From BEOL to Tiplet, and to the Future **In corporation with The Japan Institute of Electronics Packaging (JIEP)

[16a-E302-1~6] 【Open Symposium】Connection : From BEOL to Tiplet, and to the Future **In corporation with The Japan Institute of Electronics
Packaging (JIEP)

Thu. Mar 16, 2023 9:00 AM - 12:10 PM E302 (Building No. 12)

Noriaki Matsunaga(Applied Materials Japan), Yasumitsu Orii(Rapidus), Fumihiro Inoue(YNU)

10:00 AM - 10:30 AM

[16a-E302-3] NRE Cost Reduction of Domain Specific Accelerators by a Multi-IP SoC

Shinichi Ouchi1 (1.AIST)

Keywords:Domain Specific Accelerator, Proof of Concept, NRE Cost

Domain specific accelerators (DSAs) have become one of the most effective solutions in the aspect of the power performance. However, its development cost is very expensive because the DSA is a custom SoC. AI Chip design center (AIDC), a joint project of AIST and University of Tokyo, is developing a multi-IP SoC (System on a Chip) framework as a method to reduce non recursing cost on developing a DSA. In this presentation, the project is reviewed and its extension to business in practice is discussed.