10:40 AM - 11:10 AM
[16a-E302-4] Wafer-level hybrid bonding for 3D integration technologies
Keywords:3D Integration
Presentation information
Symposium (Oral)
Symposium » 【Open Symposium】Connection : From BEOL to Tiplet, and to the Future **In corporation with The Japan Institute of Electronics Packaging (JIEP)
[16a-E302-1~6] 【Open Symposium】Connection : From BEOL to Tiplet, and to the Future **In corporation with The Japan Institute of Electronics
Packaging (JIEP)
Thu. Mar 16, 2023 9:00 AM - 12:10 PM E302 (Building No. 12)
Noriaki Matsunaga(Applied Materials Japan), Yasumitsu Orii(Rapidus), Fumihiro Inoue(YNU)