[17a-B414-1~7] 17.3 Layered materials

[17a-B414-1] Sheet resistance reduction of sputtered WS₂ film by Cl₂ plasma treatment

〇(B)Keita Kuohara¹, Shinya Imai¹, Shigetaka Tomiya¹, Tetsuya Tatsumi¹, Hitoshi Wakabayashi¹ (1.Tokyo Tech)

Keywords:Transition Metal Dichalcogenide, plasma treatment, sputtering

TMDC films have attracted attention for thermoelectric device applications. In WS₂ films, which are typical TMDCs, n-type doping by chemical doping such as chlorine has been reported, but thermal instability is a concern. Therefore, we applied chlorine plasma treatment to the WS₂ film to make the doping thermally stable. The sheet resistance was measured as an evaluation. The sheet resistance of the WS₂ film with chlorine plasma treatment was reduced to about half that of the WS2 film without chlorine plasma treatment.