The 70th JSAP Spring Meeting 2023

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power devices, process technology and characterization

[18a-A301-1~13] 13.7 Compound and power devices, process technology and characterization

Sat. Mar 18, 2023 9:00 AM - 12:30 PM A301 (Building No. 6)

Kozo Makiyama(Sumitomo Electric Industries, Ltd.)

9:45 AM - 10:00 AM

[18a-A301-4] Characteristics of GaN-MOSFETs with the Al-doped surface

Katsunori Ueno1, Tsurugi Kondo1, Ryo Tanaka1, Shinya Takashima1, Masaharu Edo1, Tomoyuki Suwa2 (1.Fuji Electric co., 2.NICHe, Tohoku Univ.)

Keywords:GaN, MOSFET, channel mobility

Improving electron mobility of MOSFETs is strongly desired for the practical use of GaN-based power devices. In the previous work, we reported that MOSFETs formed on the annealed surface after AlN deposition provide high mobility. In this report the higher channel mobility can be obtained at the higher annealing temperature. The higher Al concentration at the surface was observed at the higher annealing temperature.