Special Issue: Electronic Components and Materials for Technological Innovation in the New Normal Era

Live Distribution (Zoom) » Electronic Components and Materials for Technological Innovation in the New Normal Era

Electronic Components and Materials for Technological Innovation in the New Normal Era

Tue. Nov 9, 2021 1:00 PM - 2:15 PM Room II (Live Distribution)

Chairperson:Masaki AZUMA(Tokyo Institute of Technology), Katsumi KIKUCHI(NEC Corporation)

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1:00 PM - 1:40 PM

[2-6] Memorial Lecture of JSPM Award
Development of Negative Thermal Expansion Fine Particles

〇Koshi TAKENAKA¹, Nobuya YAMADA² (1.Nagoya University, 2.Chemical Gate Co., Ltd.)

1:40 PM - 1:55 PM

[2-7A] Development of ceramic composite materials with segregated three-dimensional conductive network structure using composite granules.

〇Yusaku Sato¹, Atsushi Yokoi¹, Tan Wai Kian¹, Go Kawamura¹, Hiroyuki Muto¹, Atsunori Matsuda¹ (1.Toyohashi university of technology)

※This presenter is a candidate for the Student Award for Outstanding Presentation.

1:55 PM - 2:05 PM

[2-8B] Aerosol deposition of functional thick films using composite particles obtained by electrostatic integrated assembly

〇Shun Wakabayashi^1,2, Atsushi Yokoi¹, Wai Kian Tan¹, Go Kawamura¹, Atsunori Matsuda¹, Naoyuki Fujita², Hiroyuki Muto¹ (1.Toyohashi University of Technology, 2.National Institute of Technology, Nara College)

※This presenter is a candidate for the Student Award for Outstanding Presentation.

Break (10 min) (2:05 PM - 2:15 PM)

Session information

Electronic Components and Materials for Technological Innovation in the New Normal Era

[2-6] Memorial Lecture of JSPM Award
Development of Negative Thermal Expansion Fine Particles

[2-7A] Development of ceramic composite materials with segregated three-dimensional conductive network structure using composite granules.

[2-8B] Aerosol deposition of functional thick films using composite particles obtained by electrostatic integrated assembly

Authentication

Session information

Electronic Components and Materials for Technological Innovation in the New Normal Era

[2-6] Memorial Lecture of JSPM AwardDevelopment of Negative Thermal Expansion Fine Particles

[2-7A] Development of ceramic composite materials with segregated three-dimensional conductive network structure using composite granules.

[2-8B] Aerosol deposition of functional thick films using composite particles obtained by electrostatic integrated assembly

Authentication

[2-6] Memorial Lecture of JSPM Award
Development of Negative Thermal Expansion Fine Particles