Autumn Meeting of the Japan Society of Powder and Powder Metallurgy, 2024

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Special Interest Session » Suppression of Thermal Expansion by Negative Thermal Expansion Materials

Special Interest Session: Suppression of Thermal Expansion by Negative Thermal Expansion Materials

Wed. Nov 20, 2024 3:15 PM - 4:45 PM Room II (2F, Room 203+204)

Chairperson:Takumi Nishikubo(Kanagawa Institute of Industrial Science and Technology)

3:15 PM - 3:35 PM

[2-41] Invited Talk : Mechanical stress control through the use of negative thermal expansion materials in Integrated Circuits (ICs) 《 Physical Property 》

*Hisashi Kino1 (1. Kyushu University)

Keywords:Semiconductor, Strain engineering, Stress control

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