*THUYET MINH NGUYEN¹, JIN-CHUN KIM¹, JIN-HUNG KIM¹, DONG-WAN LEE¹ (1. School of Materials Science and Engineering, University of Ulsan, korea(Korea))

*Igor Shishkovsky¹ (1. P.N. Lebedev Physics Institute of Russian Academy of Sciences, Samara branch(Russia))

*Pei WANG¹ (1. Institute of Materials Research and Engineering(Singapore))

*Ma Qian¹ (1. Royal Melbourne Institute of Technology (RMIT University)(Australia))

*Akihiko CHIBA¹, Yuichiro KOIZUMI¹, Kenta YAMANAKA¹, Kenta AOYAGI¹, Hao WANG¹ (1. nstitute for Materials Research, Tohoku University(Japan))

*Mitsuharu Todai¹, Takayoshi Nakano², Tianqi Liu², Jongyeong Oh², Hiroyuki Yasuda², Ken Cho², Koji Hagihara³, Minoru Ueda⁴, Masao Takeyama⁵ (1. Institute of Niihama National College of Technology(Japan), 2. Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University(Japan), 3. Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University(Japan), 4. Metal Technology Co. Ltd.(Japan), 5. Department of Metallurgy and Ceramics Science, Tokyo Institute of Technology(Japan))

Shigeo Mori¹, *Kenji Doi¹, Shinpei Maruyama¹, Toru Takeuchi¹, Kazuki Hanami¹, Hisashi Kitagaki¹, Shuntaro Terauchi¹, Tomiharu Matsushita¹ (1. Osaka Yakin Kogyo Co,.Ltd(Japan))

*Masahiro Kusano¹, Shiho Miyazaki^1,2, Satoshi Kishimoto¹, Atsushi Yumoto², Makoto Watanabe^1,3 (1. National Institute for Materials Science(Japan), 2. Shibaura Institute of Technology(Japan), 3. The University of Tokyo(Japan))

*Igor Shishkovsky¹, Vladimir Sherbakoff¹ (1. P.N. Lebedev Physics Institute of Russian Academy of Sciences, Samara branch(Russia))

*Hideshi Miura¹, Kentaro Kudo², Satoshi Suehiro³, Teiichi Kimura³ (1. Research Center for Steel of Kyushu University(Japan), 2. Graduate school of Kyushu University(Japan), 3. Japan Fine Ceramics Center(Japan))

*Soshu Kirihara¹, Shoichiro Kisanuki¹, Hirotoshi Nozaki¹, Koki Nonaka¹ (1. Osaka University(Japan))

*Hirotoshi NOZAKI¹, Soshu KIRIHARA¹ (1. Joining and Welding Research Institute Osaka University(Japan))

*Shoichiro KISANUKi¹, Soshu KIRIHARA¹ (1. Joining and Welding Research Institute, Osaka University(Japan))

*Chen-Nan SUN¹, Wai Jack SIN¹, Guglielmo VASTOLA², N. SRIDHAR², Mui Ling Sharon NAI¹ (1. Singapore Institute of Manufacturing Technology (SIMTech), Agency for Science, Technology, and Research (A*STAR)(Singapore), 2. Institute of High Performance Computing (IHPC), Agency for Science, Technology, and Research (A*STAR)(Singapore))

Shinnosuke KUSAKAWA¹, Masahiro ARAKI², Kazuhiro NAKAMURA², Makiko YONEHARA¹, Toshi-Taka IKESHOJI¹, *Hideki KYOGOKU¹ (1. Kindai University(Japan), 2. TRAFAM(Japan))

*Takahiro KIMURA¹, Takayuki NAKAMOTO¹, Kazuki SUGITA², Masataka MIZUNO², Hideki ARAKI² (1. Osaka Research Institute of Industrial Science and Technology(Japan), 2. Osaka University(Japan))

*Naoyuki NOMURA¹, Takato KOUSAKA¹, Shinichi MORIYA², Takayuki NAKAMOTO³, Takahiro KIMURA³, Keiko KIKUCHI¹, Akira KAWASAKI¹ (1. Tohoku University(Japan), 2. Japan Aerospace Exploration Agency(Japan), 3. Osaka Research Institute of Industrial Science and Technology(Japan))

*Shinichiro Sato¹, Shin Mizutani¹, Yuta Koike¹, Daichi Yamaguchi¹, Takafumi Sasaki¹ (1. RICOH COMPANY, LTD.(Japan))

*Shinji Sakamoto¹, Msayuki Matsui¹, Takahiro Komatsu¹, Yoshinori Ito, katsuhiko Sakai, Hiroo Shizuka (1. Nissei Electric Co.(Japan))