3D Sequential Process Integration for CMOS Image Sensor

Junpei Yamamoto

doi:https://doi.org/10.7567/SSDM.2022.G-5-01

Presentation information

Oral Presentation

01: Advanced CMOS: Material Fundamentals / Process Science / Device Physics

[G-5] Image Sensor Technology

Wed. Sep 28, 2022 10:45 AM - 12:15 PM 301 (3F)

Session Chair: Takashi Matsukawa (AIST), Hidetoshi Oishi (Sony Semiconductor Solutions Corp.)

10:45 AM - 11:15 AM

[G-5-01 (Invited)] 3D Sequential Process Integration for CMOS Image Sensor

〇Junpei Yamamoto¹, Keiichi Nakazawa¹, Shigetaka Mori¹, Shintaro Okamoto¹, Akito Shimizu¹, Koichi Baba¹, Nobutoshi Fujii¹, Mutsuo Uehara¹, Katsunori Hiramatsu¹, Hideomi Kumano¹, Akira Matsumoto¹, Koichiro Zaitsu¹, Hidetoshi Onuma¹, Keiji Tatani¹, Tomoyuki Hirano¹, Hayato Iwamoto¹ (1. Sony Semiconductor Solutions Corp. (Japan))

Presentation style: On-site (in-person)

https://doi.org/10.7567/SSDM.2022.G-5-01

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