2022 International Conference on Solid State Devices and Materials

講演情報

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[K-1] 3D Integration and Advanced Packaging I

2022年9月27日(火) 11:30 〜 12:30 304 (3F)

Session Chair: Takeyasu Saito (Osaka Metropolitan Univ.), Jenn-Ming Song (National Chung Hsing Univ.)

12:00 〜 12:15

[K-1-03] Fabrication of the 3D-stacked retinal prosthesis chip to realize high-performance retinal prosthesis

〇Aoba Onishi1, Ryotaro Bamba1, Bungo Tanaka1, Ryouhei Kishimoto2, Hisashi Kino1, Takafumi Fukushima1,2, Tetsu Tanaka1,2 (1. Dep. of Biomed. Eng., Graduate School of Biomed. Eng., Tohoku Univ. (Japan), 2. Dep. of Mech. Sys. Eng., Graduate School of Eng., Tohoku Univ. (Japan))

Presentation style: Online

https://doi.org/10.7567/SSDM.2022.K-1-03

Retinitis pigmentosa and age-related macular degeneration

cause blindness due to the deterioration of photoreceptor cells. The retinal prosthesis has been developed to obtain the vision lost by these diseases. We have been developing a 3D-stacked retinal prosthesis chip to enhance the performance of the retinal prosthesis. This retinal prosthesis has a 3D-stacked structure, improving area efficiency and realizing high resolution, functionality, and sensitivity. This study fabricated a 3D-stacked retinal prosthesis chip and evaluated the electrical characteristics.

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