2022 International Conference on Solid State Devices and Materials

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Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[K-6] MEMS and Advanced Metallization I

Wed. Sep 28, 2022 1:30 PM - 3:30 PM 304 (3F)

Session Chair: Shigeo Yasuhara (Japan Advanced Chemicals Ltd.), Kenji Shiojima (Univ. of Fukui)

1:30 PM - 2:00 PM

[K-6-01 (Invited)] Further Scaling Challenges and Opportunities

〇Takashi Hayakawa1 (1. TEL (Japan))

Presentation style: On-site (in-person)

https://doi.org/10.7567/SSDM.2022.K-6-01

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