2022 International Conference on Solid State Devices and Materials

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Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[K-6] MEMS and Advanced Metallization I

Wed. Sep 28, 2022 1:30 PM - 3:30 PM 304 (3F)

Session Chair: Shigeo Yasuhara (Japan Advanced Chemicals Ltd.), Kenji Shiojima (Univ. of Fukui)

2:15 PM - 2:30 PM

[K-6-03] Concentration Monitoring of H2O2 Based Slurry for Metal Chemical Mechanical Planarization (CMP) using Raman Spectroscopy

〇Jinhyun Choe1, Jinseok Kim1, Dawon Ahn1, Eunsu Jung1, Sunggyu Pyo1 (1. Chung-Ang University (Korea))

Presentation style: Online

https://doi.org/10.7567/SSDM.2022.K-6-03

Raman spectroscopy is a non-destructive, highly sensitive, rapid analysis method that measures the degree of Raman scattering of light to detect a specific component and is easy to use for liquid phase analysis due to low water interference. In this study, the feasibility of quantitative concentration monitoring was shown using Raman spectroscopy to detect H2O2 in slurry for Copper Chemical Mechanical Planarization (CMP) process. Through Raman analysis of H2O2 based slurry, it was found that the degree of Raman scattering was linearly changed ac-cording to the concentration of H2O2 in the slurry solution, and the equation showed high linearity with an R^2 value of 0.99. This result indicates that quantitative concentration analysis of H2O2 based slurry is possible using Raman spectroscopy.

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