[S-IIIB-6] Diffusion Barrier with Reactively Sputtered TiN Film for Thermally Stable Contact in Advanced VLSI

Katsunori MITSUHASHI, Osamu YAMAZAKI, Atsuhisa INOUE, Tatsuo MORITA, Koui OHTAKE, Masayoshi KOBA (1.Central Research Laboratories, Sharp Corporation, 2.Material Research and Analysis Center, Sharp Corporation)

https://doi.org/10.7567/SSDM.1988.S-IIIB-6