Wafer Bonding and Thinning for High-Speed SOI Epitaxial-Base Tansistors

Atsushi FUKURODA; Toru MIYABO; Manabu KOJIMA; Tetsu FUKANO; Naoshi HIGAKI; Tatsuya YAMAZAKI; Toshihiro SUGII; Yoshihiro ARIMOTO; Takashi ITO

doi:https://doi.org/10.7567/SSDM.1991.A-6-2

1991 International Conference on Solid State Devices and Materials

Aug 27, 1991 - Aug 29, 1991
Pacifico Yokohama, Yokohama, Japan

[A-6-2] Wafer Bonding and Thinning for High-Speed SOI Epitaxial-Base Tansistors

Atsushi FUKURODA, Toru MIYABO, Manabu KOJIMA, Tetsu FUKANO, Naoshi HIGAKI, Tatsuya YAMAZAKI, Toshihiro SUGII, Yoshihiro ARIMOTO, Takashi ITO (1.Fujitsu Laboratories Ltd.)

https://doi.org/10.7567/SSDM.1991.A-6-2

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