[A-6-2] Wafer Bonding and Thinning for High-Speed SOI Epitaxial-Base Tansistors

Atsushi FUKURODA、Toru MIYABO、Manabu KOJIMA、Tetsu FUKANO、Naoshi HIGAKI、Tatsuya YAMAZAKI、Toshihiro SUGII、Yoshihiro ARIMOTO、Takashi ITO (1.Fujitsu Laboratories Ltd.)

https://doi.org/10.7567/SSDM.1991.A-6-2