[S-D-4] High Performance Copper Metallization for ULSI Interconnects

Masahito OTSUKI、Toshiyuki TAKEWAKI、Hideshi KUWABARA、Tadashi SHIBATA、Tadahiro OHMI、Takahisa NITTA (1.Department of Electronics, Tohoku University、2.Device Development Center, Hitachi Ltd.)

https://doi.org/10.7567/SSDM.1991.S-D-4