[S-D-4] High Performance Copper Metallization for ULSI Interconnects

Masahito OTSUKI, Toshiyuki TAKEWAKI, Hideshi KUWABARA, Tadashi SHIBATA, Tadahiro OHMI, Takahisa NITTA (1.Department of Electronics, Tohoku University, 2.Device Development Center, Hitachi Ltd.)

https://doi.org/10.7567/SSDM.1991.S-D-4