[LB-L6] Three-Diensional Integration Technology Based on Wafer Bonding Technique Using Micro-Bumps

T. Matsumoto, Y. Kudoh, M. Tahara, K.-H. Yu, N. Miyakawa, H. Itani, T. Ichikizaki, A. Fujiwara, H. Tsukamoto, M. Koyanagi (1.Dept. of Machine Intelligence and System Engineering, Tohoku University, 2.Fuji Xerox Co., 3.Mitsubishi Heavy Industries, Ltd.)

https://doi.org/10.7567/SSDM.1995.LB-L6