[LB-L6] Three-Diensional Integration Technology Based on Wafer Bonding Technique Using Micro-Bumps

T. Matsumoto、Y. Kudoh、M. Tahara、K.-H. Yu、N. Miyakawa、H. Itani、T. Ichikizaki、A. Fujiwara、H. Tsukamoto、M. Koyanagi (1.Dept. of Machine Intelligence and System Engineering, Tohoku University、2.Fuji Xerox Co.、3.Mitsubishi Heavy Industries, Ltd.)

https://doi.org/10.7567/SSDM.1995.LB-L6