[B-1-5] CMP with Pad-Press Ring for Superior Uniformity Performance

Mikio Nishio、Tomoyasu Murakami、Masashi Hamanaka (1.Semiconductor Research Center, Matsushita Electric Industrial, Co., Ltd.、2.Kyoto Research Laboratory, Matsushita Electronics Corporation)

https://doi.org/10.7567/SSDM.1996.B-1-5