[LA-3] Effective KOH Etching Prior to Modified Secco Etching for Analyzing Defects in Thin Bonded SOI Wafers

Kiyoshi Mitani, Hiroji Aga, Masatake Nakano (1.Isobe R&D Center, Shin-Etsu Handotai)

https://doi.org/10.7567/SSDM.1996.LA-3