[PC-5-5] A 100±15nm Thick 8-inch Bonded SOI Fabricated with a Selective Polishing Method

M. Hashimoto、Y. Ohkubo、M. Shimanoe、M. Nakamura、H. Sato、H. Komatsu、Y. Miyazawa (1.ULSI R&D Laboratories, Semiconductor Company, Sony Corporation)

https://doi.org/10.7567/SSDM.1996.PC-5-5