[PD-4-3] A Novel LOCOS-Trench Combination Isolation Method for Maximum Chemical Mechanical Polishing(CMP) Process Window

Tai-su PARK、Moon Han PARK、Han Sin LEE、Sung Eui KIM、Yu Gyun SHIN、Ho Kyu KANG、Moon Yong LEE (1.Semiconductor R&D Center, Samsung Electronics Co., Ltd.)

https://doi.org/10.7567/SSDM.1996.PD-4-3