A Novel Shallow Trench Isolation Technique

Juing-Yi Cheng; Tan Fu Lei; Tien Sheng Chao

doi:https://doi.org/10.7567/SSDM.1996.PD-4-5

1996 International Conference on Solid State Devices and Materials

1996年8月26日〜 1996年8月29日
Pacifico Yokohama, Yokohama, Japan

[PD-4-5] A Novel Shallow Trench Isolation Technique

Juing-Yi Cheng、Tan Fu Lei、Tien Sheng Chao (1.Department of Electronics Engineering and Institute of Electronics National Chiao Tung University and、2.National Nano Device Laboratory)

https://doi.org/10.7567/SSDM.1996.PD-4-5

▲