[Sympo.I-1] Smart-Cut: A New S.O.I. Material Technology Based on Hydrogen Implantation and Wafer Bonding

MICHEL BRUEL、Bernard ASPAR Andre-Jacques AUBERTON-HERVE (1.LETI/CEA Departement de Microtechnologies、2.SOITEC)

https://doi.org/10.7567/SSDM.1996.Sympo.I-1