[Sympo.I-6] Advanced SOI Devices Using CMP and Wafer Bonding

Hiroshi HORIE, Shunji NAKAMURA, Yasuo NARA, Kunihiro SUZUKI, Tetsu TANAKA, Masahiko IMAI, Akio ITOH, Yoshihiro ARIMOTO (1.Fujitsu Laboratories Ltd.)

https://doi.org/10.7567/SSDM.1996.Sympo.I-6