[Sympo.I-6] Advanced SOI Devices Using CMP and Wafer Bonding

Hiroshi HORIE、Shunji NAKAMURA、Yasuo NARA、Kunihiro SUZUKI、Tetsu TANAKA、Masahiko IMAI、Akio ITOH、Yoshihiro ARIMOTO (1.Fujitsu Laboratories Ltd.)

https://doi.org/10.7567/SSDM.1996.Sympo.I-6