[Sympo.II-5] Process Integration of O3-TEOS CVD SiO2 for a Cover Film on Ferroelectric Capacitors

J. Kawahara, T. Matsuki, K. Kishimoto, K. Koyanagi, Y. Hayashi (1.Microelectronics Res. Labs., ULSI Device Development Labs., NEC Corporation)

https://doi.org/10.7567/SSDM.1996.Sympo.II-5