[Sympo.II-5] Process Integration of O3-TEOS CVD SiO2 for a Cover Film on Ferroelectric Capacitors

J. Kawahara、T. Matsuki、K. Kishimoto、K. Koyanagi、Y. Hayashi (1.Microelectronics Res. Labs., ULSI Device Development Labs., NEC Corporation)

https://doi.org/10.7567/SSDM.1996.Sympo.II-5