W-Plug Common Contact with CoSi2 Ohmic Layer for Scaled DRAM and Merged DRAM in Logic (MDL) Devices

Siyoung Choi; Bong-Young Yoo; Hyeon-Deok Lee; Ho-Kyu Kang; Moon-Yong Lee

doi:https://doi.org/10.7567/SSDM.1997.A-10-4

1997 International Conference on Solid State Devices and Materials

Sep 16, 1997 - Sep 19, 1997
ACT CITY Hamamatsu, Hamamatsu, Japan

[A-10-4] W-Plug Common Contact with CoSi2 Ohmic Layer for Scaled DRAM and Merged DRAM in Logic (MDL) Devices

Siyoung Choi, Bong-Young Yoo, Hyeon-Deok Lee, Ho-Kyu Kang, Moon-Yong Lee (1.L/S Process Development, Semiconductor R&D Center, Samsung Electronics Co., LTD.)

https://doi.org/10.7567/SSDM.1997.A-10-4

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