Directional Plasma CVD Technology for Sub-Quarter Micrometer Feature Size Multilevel Interconnection

Yutaka Kudoh; Yoshio Homma; Noriyuki Sakuma; Takeshi Furusawa

doi:https://doi.org/10.7567/SSDM.1997.A-11-1

1997 International Conference on Solid State Devices and Materials

Sep 16, 1997 - Sep 19, 1997
ACT CITY Hamamatsu, Hamamatsu, Japan

[A-11-1] Directional Plasma CVD Technology for Sub-Quarter Micrometer Feature Size Multilevel Interconnection

Yutaka Kudoh, Yoshio Homma, Noriyuki Sakuma, Takeshi Furusawa (1.Hitachi Electronics Engineering Co. Ltd., 2.Central Research Laboratory, Hitachi, Ltd.)

https://doi.org/10.7567/SSDM.1997.A-11-1

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