[A-11-1] Directional Plasma CVD Technology for Sub-Quarter Micrometer Feature Size Multilevel Interconnection

Yutaka Kudoh、Yoshio Homma、Noriyuki Sakuma、Takeshi Furusawa (1.Hitachi Electronics Engineering Co. Ltd.、2.Central Research Laboratory, Hitachi, Ltd.)

https://doi.org/10.7567/SSDM.1997.A-11-1