[B-1-3] An Optimized Via Contact Scheme of FeRAM for Double-Level Metallization and Beyond

Yoo-Sang Hwang, Jin-Woo Lee, Sung-Yung Lee, Bon-Jae Koo, Dong-Jin Jung, Yoon-Soo Chun, Mi-Hyang Lee, Dong-Won Shin, Soo-Ho Shin, Sang-Eun Lee, Byung-Hee Kim, Nam-Soo Kang, Ki-Nam Kim (1.Technology Development, Semiconductor R&D Center, Samsung Electronics Co.)

https://doi.org/10.7567/SSDM.1997.B-1-3