[B-1-3] An Optimized Via Contact Scheme of FeRAM for Double-Level Metallization and Beyond

Yoo-Sang Hwang、Jin-Woo Lee、Sung-Yung Lee、Bon-Jae Koo、Dong-Jin Jung、Yoon-Soo Chun、Mi-Hyang Lee、Dong-Won Shin、Soo-Ho Shin、Sang-Eun Lee、Byung-Hee Kim、Nam-Soo Kang、Ki-Nam Kim (1.Technology Development, Semiconductor R&D Center, Samsung Electronics Co.)

https://doi.org/10.7567/SSDM.1997.B-1-3