Wafer Bonding of InP to Si and Its Application to Optical Devices

Hiroshi Wada; Takeshi Kamijoh

doi:https://doi.org/10.7567/SSDM.1997.C-2-1

1997 International Conference on Solid State Devices and Materials

Sep 16, 1997 - Sep 19, 1997
ACT CITY Hamamatsu, Hamamatsu, Japan

[C-2-1] Wafer Bonding of InP to Si and Its Application to Optical Devices

Hiroshi Wada, Takeshi Kamijoh (1.Optoelectronics Oki Laboratory, Real World Computing Partnership c/o Semiconductor Technology Laboratory, Oki Electric Industry Co., Ltd.)

https://doi.org/10.7567/SSDM.1997.C-2-1

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