[C-3-3] InGaAsP Laser on GaAs Fabricated by the Surface Activated Wafer Direct Bondind Method at Room Temperature

TaekRyong CHUNG、Hideki TAKAGI、Naoe HOSODA、Tadatomo SUGA (1.The University of Tokyo, RCAST、2.Mechanical Engineering Lab. AIST, MITI)

https://doi.org/10.7567/SSDM.1997.C-3-3