[C-1-3] A New Scaled Through Si Via with Polymer Fill for 3D Wafer Level Packaging

D. S. Tezcan¹、F. Duval¹、O. Luhn¹、P. Soussan¹、B. Swinnen¹ (1.IMEC, Belgium)

https://doi.org/10.7567/SSDM.2008.C-1-3