[C-10-3] Defect-less Monolithic Low-k/Cu Interconnects by Chemistry-controlled CMP

M. Ueki¹、T. Onodera¹、A. Ishikawa²、S. Hoshino²、Y. Hayashi¹ (1.NEC Electronics Corp.、2.Nikon Corp., Japan)

https://doi.org/10.7567/SSDM.2008.C-10-3