Interconnect and Packaging Technology for CMOS Image Sensors (Invited)

J. Gambino; B. Leidy; R. J. Rassel; J. Adkisson; J. Ellis-Monaghan; C. Musante; K. Ackerson; B. Guthrie; W. Abadeer; D. Meatyard; S. Mongeon; M. Jaffe

doi:https://doi.org/10.7567/SSDM.2008.C-8-4

2008 International Conference on Solid State Devices and Materials

2008年9月23日〜 2008年9月26日
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[C-8-4] Interconnect and Packaging Technology for CMOS Image Sensors (Invited)

J. Gambino¹、B. Leidy¹、R. J. Rassel¹、J. Adkisson¹、J. Ellis-Monaghan¹、C. Musante¹、K. Ackerson¹、B. Guthrie¹、W. Abadeer¹、D. Meatyard¹、S. Mongeon¹、M. Jaffe¹ (1.IBM, USA)

https://doi.org/10.7567/SSDM.2008.C-8-4

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