Interconnect and Packaging Technology for CMOS Image Sensors (Invited)

J. Gambino; B. Leidy; R. J. Rassel; J. Adkisson; J. Ellis-Monaghan; C. Musante; K. Ackerson; B. Guthrie; W. Abadeer; D. Meatyard; S. Mongeon; M. Jaffe

doi:https://doi.org/10.7567/SSDM.2008.C-8-4

2008 International Conference on Solid State Devices and Materials

Sep 23, 2008 - Sep 26, 2008
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[C-8-4] Interconnect and Packaging Technology for CMOS Image Sensors (Invited)

J. Gambino¹, B. Leidy¹, R. J. Rassel¹, J. Adkisson¹, J. Ellis-Monaghan¹, C. Musante¹, K. Ackerson¹, B. Guthrie¹, W. Abadeer¹, D. Meatyard¹, S. Mongeon¹, M. Jaffe¹ (1.IBM, USA)

https://doi.org/10.7567/SSDM.2008.C-8-4

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