[D-5-2] Self-Assembly for Heterogeneous Integration with Lateral Interconnections Extending over MEMS and LSI Chips

T. Konno¹、T. Fukushima¹、R. Kobayashi¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ., Japan)

https://doi.org/10.7567/SSDM.2008.D-5-2