[P-5-1] The Formation of Lateral Interconnections Extending over 100-μm-Thick Chips

M. Murugesan¹, J. Bea¹, T. Konno¹, H. Kino¹, Y. Ohara¹, T. Fukushima¹, T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ., Japan)

https://doi.org/10.7567/SSDM.2008.P-5-1