Ultrathin Body and BOX SOI and <sub>S</sub>SOI for Low Power Application at the 22nm technology node and below

F. Andrieu; C. Fenouillet-Béranger; O. Weber; S. Baudot; C. Buj; J. P. Noel; O. Thomas; O. Rozeau; P. Perreau; L. Tosti; L. Brévard; O. Faynot

doi:https://doi.org/10.7567/SSDM.2009.A-1-1

[A-1-1] Ultrathin Body and BOX SOI and _SSOI for Low Power Application at the 22nm technology node and below

F. Andrieu¹, C. Fenouillet-Béranger¹, O. Weber¹, S. Baudot¹, C. Buj¹, J. P. Noel¹, O. Thomas¹, O. Rozeau¹, P. Perreau¹, L. Tosti¹, L. Brévard¹, O. Faynot¹ (1.CEA-LETI/MINATEC)

https://doi.org/10.7567/SSDM.2009.A-1-1

2009 International Conference on Solid State Devices and Materials

[A-1-1] Ultrathin Body and BOX SOI and SSOI for Low Power Application at the 22nm technology node and below

[A-1-1] Ultrathin Body and BOX SOI and _SSOI for Low Power Application at the 22nm technology node and below