[D-1-1] Through-Si-Via Technology Solutions for 3D System Integration

E. Beyne¹、B. Swinnen¹、J. V. Olmen¹、D. S. Tezcan¹、A. Jourdain¹、P. Limaye¹ (1.IMEC)

https://doi.org/10.7567/SSDM.2009.D-1-1