[D-1-1] Through-Si-Via Technology Solutions for 3D System Integration

E. Beyne¹, B. Swinnen¹, J. V. Olmen¹, D. S. Tezcan¹, A. Jourdain¹, P. Limaye¹ (1.IMEC)

https://doi.org/10.7567/SSDM.2009.D-1-1