[D-1-2] Development of EEB (Electroplated-Evaporation Bumping) Technology for Fine Pitch and Low Resistance Cu/Sn Micro-Bumps

Y. Ohara¹、A. Noriki¹、E. Iwata¹、T. Hiraki¹、K. W. Lee¹、M. Murugesan¹、J. C. Bea¹、T. Fukushima¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ.)

https://doi.org/10.7567/SSDM.2009.D-1-2