[D-1-2] Development of EEB (Electroplated-Evaporation Bumping) Technology for Fine Pitch and Low Resistance Cu/Sn Micro-Bumps

Y. Ohara¹, A. Noriki¹, E. Iwata¹, T. Hiraki¹, K. W. Lee¹, M. Murugesan¹, J. C. Bea¹, T. Fukushima¹, T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ.)

https://doi.org/10.7567/SSDM.2009.D-1-2