[D-1-3] High-Aspect-Ratio Fine Cu Sidewall Interconnection over Chip Edge with Tapered Polymer for MEMS-LSI Multi-Chip Module

A. Noriki¹、Y. Kaiho¹、E. Iwata¹、Y. Ohara¹、M. Murugesan¹、K. W. Lee¹、J. C. Bea¹、T. Fukushima¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ.)

https://doi.org/10.7567/SSDM.2009.D-1-3