[D-1-3] High-Aspect-Ratio Fine Cu Sidewall Interconnection over Chip Edge with Tapered Polymer for MEMS-LSI Multi-Chip Module

A. Noriki¹, Y. Kaiho¹, E. Iwata¹, Y. Ohara¹, M. Murugesan¹, K. W. Lee¹, J. C. Bea¹, T. Fukushima¹, T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ.)

https://doi.org/10.7567/SSDM.2009.D-1-3