[D-1-4] Back-Side Illuminated CMOS Image Sensor Fabricated using Compliant Bump

N. Watanabe¹、I. Tsunoda²、T. Takao¹、K. Tanaka³、T. Asano¹ (1.Kyushu Univ.(Japan)、2.Kyushu Inst. Of Tech.(Japan)、3.Kyushu Sangyo Univ.(Japan))

https://doi.org/10.7567/SSDM.2009.D-1-4